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Week in Review: Auto, Security, Ubiquitous Computing

Automotive, mobility
Renesas and AI chipmaker Hailo are working together on a hardware combo for motor vehicle driving automation systems – ADAS (advanced driver assistance systems) and ADS (automated driving systems). The companies are combining Hailo-8 processors for accelerating neural networks with Renesas’ R-Car V3H and R-Car V4H systems on a chip (SoC). The solutions range from ADAS L2+ functions up to AD L4 functions, for zonal and centralized vehicle ECUs.

Cadence launches two new IP DSP cores in its Tensilica ConnX family of radar, lidar and communication DSPs, targeting the automotive, consumer and industrial markets. The Tensilica ConnX 110 (128-bit) and ConnX 120 (256-bit) DSPs have an N-way programming model. DSPs are supported by complex mathematical library functions in the NatureDSP, Eigen and Radar libraries. The ConnX 120 offers Viterbi and Turbo decoders. ConnX DSPs are automotive ready with full ISO 26262 compliance to ASIL-D with FlexLock or ASIL-B.

Cadence also announced its portfolio of Xcelium apps, which run natively on Cadence’s Xcelium Logic Simulator core for automotive, mobile and hyperscale design teams. Applications include Xcelium Machine Learning, Mixed-Signal, Multi-Core, Safety, Power Playback and X-Pessimism Removal. The latter application is to shorten debugging time using algorithms “to make the propagation of ‘X’ values ​​in the simulation more accurate”.

Bus and truck manufacturer Scania will use key sightfrom Scienlab Battery Test Solutions for its new state-of-the-art battery laboratory at its new research and development facility in Södertälje, Sweden. The facility will test battery technology for electric vehicles. Scania is part of the Volkswagen Group.

Renesas work with Tata Group companies Tata Engines ltd. (TML) and Tejas networks in India to develop automotive electronics, particularly for electric vehicles and connected vehicles. Tejas and Renesas will collaborate on wireless networking hardware, such as radio units.

Ubiquitous Computing
THIS WILL and Flexible Logix created a silicon implementation of the CEVA-X2 DSP that can modify its instruction set. The silicon implementation, an ASIC called CEVA SOC2, uses Flex Logix’s EFLX embedded FPGA (eFPGA) connected to a CEVA-X2 DSP instruction expansion interface. Bar-Ilan University SoC Labwho is a member of the HiPer Consortiumsupported by public funding Israel Innovation Authority (IIA), designed and registered the SOC2 for TSMC 16nm technology. “SOC2 contains two processing clusters, each containing two CEVA-X2 DSP and eFPGA EFLX cores for programming and executing DSP instruction extensions, connected using the CEVA-Xtend mechanism. Flex Logix and joint CEVA customers can now confidently use custom instructions to extract more value from their ASIC by being able to target different DSP applications in addition to communication and audio with customizable ISA post-manufacturing,” said Erez Bar-Niv, CTO of CEVA, said in a statement.

Synopsis optimized its design and verification tools and intellectual property for the latest Arms SoC based on v9 architecture, Cortex-A715, Cortex-A510 and Cortex-X3 processors and Immortalis-G715, Mali-G715 and Mali-G615 gaming optimized GPUs. Synopsys’ Digital Design Family, Verification Family, and Interface IP (controllers and PHYs) in the form of QuickStart (QIK) Implementation Kits for 5, 4, and 3 nm help early adopters achieve PPP targets, according to a press release. Arm v9 SoCs are used in mobile applications for laptops, smartphones, games, and augmented/virtual reality.

Cadence also works with Arms to optimize tools for Arm Total Compute Solutions 2022 (TCS22), which are Arm Cortex-A715 and Cortex-X3 processors and Arm Mali-G715 and Immortalis-G715 GPUs. Cadence provided Rapid Adoption Kits (RAKs) of RTL to GDS digital streams for the 5nm and 7nm nodes.

Siemens and Nvidia connect Siemens Xcelerator, the open digital business platform with physics-based digital models, and NVIDIA Omniverse, a 3D design and collaboration platform, for use in industrial environments. The goal is to enable customers of all sizes to create digital twins with real-time data and software-defined AI systems. The platforms provide ways to build industrial IoT systems and help customers learn from analytics. Siemens software for digital industries recently announced that it is extending its Xcelerator platform to be useful to all businesses that need to bridge the physical and digital worlds by helping to break down silos between operational technology (OT) and technology teams information (IT).

Renesas and integrated voice system provider cyberon Put Voice User Interface (VUI) interface into Renesas line RA MCU. The VUI will support over 40 global languages. RA MCU users will have access to Cyberon’s VUI toolchain. Renesas is developing a voice reference hardware platform for prototyping voice interfaces. The platform will not need a network connection using Cyberon’s Dspotter tool, which has a phoneme-based modeling approach. Other features include power-saving voice activity detection (VAD), voice audio playback and (VAP) to enable voice input and voice responses, among other features.

cannon used AMDof the Versal AI Core series, with AMD AI Engine technology, to process 3D video images in real time for Canon’s Free Viewpoint video system used in sports broadcasting. The video system will allow viewers to access different camera angles and slow down the video.

Read more news about Manufacturing, test and design, low power.

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Susan Rambo

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Susan Rambo is the managing editor of Semiconductor Engineering.